StructureScope
Thermal transient characterization and active power cycling for power semiconductors, in one rack.
Measure junction-to-case resistance to JESD51-14, resolve every layer of the heat path with structure functions, and track die-attach and bond-wire degradation in situ during power cycling.
One platform for thermal characterization and lifetime testing
Capture cooling curves from 1 µs onward and compute Zth, Rth-jc by transient dual interface, and structure functions.
Cycle up to 24 devices at up to 2000 A with ΔTj, ΔTc, power or time control and per-cycle electrical monitoring.
Interrupt cycling automatically to record a structure function, so degradation is located in a specific layer as it happens.
Structure functions, Foster and Cauer model export, degradation trends and reports, with a Python API for automation.
Two applications, included with every system
Runs the instrument. Set up transient thermal and power cycling tests, manage calibrations, and evaluate and report results.
- Test templates for JESD51-14 and AQG 324
- Automated K-factor calibration
- Zth, Rth-jc and degradation reports
- Python API, REST and SCPI
Turns measured transients into cumulative and differential structure functions, and compares them across devices and cycle counts.
- Cumulative and differential structure functions
- Overlay and difference views across cycles
- Foster and Cauer model export to SPICE
- CSV and HDF5 import and export
Built for microsecond transients and kiloampere cycling
Modular current sources and a shared measurement core let one system serve a single-die LED and a 1700 V traction module.
| Measurement delay | ≤ 1 µs |
| Sampling | 1 MS/s, 16 bit |
| Tj resolution | 0.01 K |
| Heating current | up to 400 A |
| Power cycling current | up to 2000 A |
| Cold plate range | −40 to +150 °C |
Qualification and failure analysis
For reliability and packaging teams at device, module and system manufacturers.
- Rth-jc for datasheets to JESD51-14
- Lifetime testing to AQG 324
- Root-cause analysis of package degradation
Research and teaching
For university groups working on devices, packaging materials and electro-thermal modeling.
- Compact thermal models for simulation
- Open data export and scripting
- Shared-facility scheduling and user accounts
Results from the lab
