StructureScope Pro
Placeholder: StructureScope measurement core, scaled for high-current modules and parallel test.
Placeholder copy. Describe what Pro adds over StructureScope, e.g. higher load current, more DUT positions, and shorter measurement delay for wide-bandgap devices.
Placeholder: what Pro adds
Placeholder: up to 4000 A power cycling for large traction and wind modules.
Placeholder: up to 64 measurement channels for production-scale qualification lots.
Placeholder: shorter measurement delay for SiC and GaN devices.
Two applications, included with every system
Runs the instrument. Set up transient thermal and power cycling tests, manage calibrations, and evaluate and report results.
- Test templates for JESD51-14 and AQG 324
- Automated K-factor calibration
- Zth, Rth-jc and degradation reports
- Python API, REST and SCPI
Turns measured transients into cumulative and differential structure functions, and compares them across devices and cycle counts.
- Cumulative and differential structure functions
- Overlay and difference views across cycles
- Foster and Cauer model export to SPICE
- CSV and HDF5 import and export
Placeholder: Pro at a glance
Placeholder figures. Replace once Pro specifications are fixed.
| Measurement delay | ≤ 0.5 µs (TBC) |
| Sampling | 2 MS/s (TBC) |
| Tj resolution | 0.01 K |
| Heating current | up to 1000 A (TBC) |
| Power cycling current | up to 4000 A (TBC) |
| Channels | 64 (TBC) |
Qualification and failure analysis
For reliability and packaging teams at device, module and system manufacturers.
- Rth-jc for datasheets to JESD51-14
- Lifetime testing to AQG 324
- Root-cause analysis of package degradation
Research and teaching
For university groups working on devices, packaging materials and electro-thermal modeling.
- Compact thermal models for simulation
- Open data export and scripting
- Shared-facility scheduling and user accounts