StructureScope
Thermal measurement systems for power electronics
Instruments for characterizing how heat leaves a semiconductor package, and how that changes over its life. Used by reliability teams in industry and by research groups at universities.
Product line
StructureScope
StructureScope
Transient thermal characterization and active power cycling for power semiconductors, in one rack.
≤ 1 µsmeasurement delay
2000 Acycling current
32channels
Includes
CORE Instruments Analysis Suite
Structure Function Explorer
View StructureScope →StructureScope ProComing 2027
Placeholder: higher current and channel count for module-level qualification and production audit labs.
≤ 0.5 µsdelay (TBC)
4000 Acycling (TBC)
64channels (TBC)
IncludesCORE Instruments Analysis SuiteStructure Function Explorer
View StructureScope Pro →In use at industrial and academic labs
Industrial labs
Qualification and failure analysis
For reliability and packaging teams at device, module and system manufacturers.
- Rth-jc for datasheets to JESD51-14
- Lifetime testing to AQG 324
- Root-cause analysis of package degradation
Academic labs
Research and teaching
For university groups working on devices, packaging materials and electro-thermal modeling.
- Compact thermal models for simulation
- Open data export and scripting
- Shared-facility scheduling and user accounts
Case studies
All case studies →Results from the lab
Client name withheld
Automotive · Tier-1 supplierDie-attach fatigue in SiC traction modules+7 %Rth increase at the die attach, detected at 18,000 cycles
