Specifications
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Values are for the standard configuration. Current and channel count scale with additional source modules.
01
Transient thermal measurement
Static and dynamic test methods to JESD51-1 and JESD51-14 (transient dual interface).
| Parameter | Value |
|---|---|
| Heating current per channel | 0.01 – 50 A |
| Heating current with booster | up to 400 A |
| Sense current | 0.1 – 200 mA |
| Sampling rate | 1 MS/s, 16 bit |
| Measurement delay after switch-off | ≤ 1 µs |
| Junction temperature resolution | 0.01 K |
| Transient length | 1 µs – 4000 s |
| Measurement channels | 8 (expandable to 32) |
02
Active power cycling
Accelerated lifetime testing with online junction temperature and Rth monitoring.
| Parameter | Value |
|---|---|
| Load current | 250 A per module, up to 2000 A |
| DUT positions | up to 24 in series strings |
| Cycle time (ton / toff) | 0.5 s – 60 min |
| Control strategies | const. ton/toff, ΔTc, P, ΔTj |
| Online monitoring | VCE/VDS, Tj,max, ΔTj, Rth per cycle |
| In-situ structure function | every n cycles, user-defined |
| Gate drive | ±25 V, per position |
03
Thermal environment
Temperature-controlled baseplates and fluid interfaces for repeatable boundary conditions.
| Parameter | Value |
|---|---|
| Cold plate temperature range | −40 to +150 °C |
| Temperature stability | ± 0.05 K |
| Coolant interface | water-glycol, 2 – 20 l/min |
| Calibration (K-factor) | automated, 3 – 20 points |
| Dry still-air chamber | JESD51-2A, optional |
04
Analysis software
Acquisition, evaluation and reporting in one application, with scripted access for automation.
| Parameter | Value |
|---|---|
| Structure functions | cumulative and differential |
| Compact models | Foster / Cauer RC network export |
| Zth and Rth evaluation | Rth-jc (TDIM), Rth-ja, Zth(t) |
| Degradation tracking | per-layer Rth trend vs. cycles |
| Automation | Python API, REST, SCPI |
| Data export | CSV, HDF5, MATLAB, SPICE |
05
System
Rack-mounted, modular hardware. Values for the standard two-rack configuration.
| Parameter | Value |
|---|---|
| Form factor | 19 in rack, 2 × 42 U |
| Mains supply | 400 V AC, 3-phase, 32 A |
| Host interface | Gigabit Ethernet |
| Safety interlock | door, coolant flow, overtemperature |
| Operating environment | 15 – 35 °C, non-condensing |
06
Standards
Test procedures implemented as editable templates.
| Parameter | Value |
|---|---|
| Thermal characterization | JESD51-1, -14, -51, -52 |
| Military | MIL-STD-750 1012 / 3101 / 3103 |
| Power cycling | AQG 324, IEC 60749-34 |
| Discrete devices | IEC 60747-9, -15 |
| Intermittent operating life | JESD22-A122 |